Hardware manufacturing accounts for a large and growing share of computing’s environmental impact. This thrust develops strategies to reduce embodied costs through a “reduce, reuse, recycle” framework. Reduce targets fabrication costs through heterogeneous integration and 3D stacking. Reuse extends hardware lifespans via disaggregated architectures that decouple component upgrade cycles. Recycle enables secondary hardware markets through wear-level tracking that establishes residual value and remaining useful life.
Key Research Questions
- How much embodied carbon can chiplet-based and 3D-integrated designs save compared to monolithic fabrication?
- Can datacenter disaggregation extend hardware utilization by decoupling component lifecycles?
- What mechanisms and market structures support reliable secondary hardware markets at scale?
| Role | PI | Institution |
|---|---|---|
| Lead | Gage Hills | Harvard |
| Collaborator | David Brooks | Harvard |
| Collaborator | Udit Gupta | Cornell |
| Collaborator | Vincent Liu | Penn |
| Collaborator | Christopher Stewart | Ohio State |

